Process for encapsulating microelectronic semi-conductor and layer type circuits
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United States of America Patent
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Nov 15, 1988
Grant Date -
N/A
app pub date -
Jul 16, 1986
filing date -
Nov 17, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for encapsulating microelectronic hybrid semi-conductor circuits or microelectronic semi-conductor components in which the components, located on a substrate, receive a soft, sealable poured-on plastic coating, are covered with a plastic/metal composite film or foil and are, if necessary, then encapsulated with a hard synthetic resin sealing compound which is resistant to thermal shock. The external plastic layers of the film or foil combine with the filler or sealing compound and thus form an encapsulation which is temperature and moisture resistant.
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