Subcutaneous housing assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 22, 1988
Grant Date -
N/A
app pub date -
Jan 28, 1987
filing date -
Jan 28, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A housing assembly for electronic circuitry that can be used subcutaneously. The housing assembly comprises container and base subassemblies each comprising a ceramic portion and a continuous metal sealing flange having a first portion brazed to the ceramic portion around its periphery, and a second portion spaced from the ceramic portion. The ceramic portion of the container subassembly is dish-like to define a cavity, and has a plurality of electric leads brazed to and extending through it. Electronic components are placed in the cavity and attached to the leads, after which the sealing flanges are nested together and welded together along the distal edges of their second portions to close and seal the housing assembly.
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Cited Art Landscape
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