Eletronic endoscope with an imaging device having side bonding pads
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United States of America Patent
Stats
-
Nov 22, 1988
Grant Date -
N/A
app pub date -
Aug 10, 1987
filing date -
Sep 4, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic endoscope, equipped with an imaging apparatus having side bonding pads, is provided with a flexible insertable part which is formed to be small in diameter. Within a tip of the insertable part, a solid state imaging device is formed and a solid state imaging chip is provided with chip side bonding pads. The solid state imaging chip is secured to a base provided with base side bonding pads in groups. The chip side bonding pads and base side bonding pads are connected respectively with each other through bonding wires. The chip side bonding pads are provided on one side of the image area in a plurality of rows.
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