Method of fabricating a multilayer circuit board assembly
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United States of America Patent
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-
Dec 6, 1988
Grant Date -
N/A
app pub date -
May 20, 1987
filing date -
May 20, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of fabricating a multilayer circuit board assembly capable of operating at microwave frequencies. Specifically, multilayer circuits such as complex beam forming networks and antennas having internal via holes may be fabricated in a single bonding cycle. This is accomplished by first preparing individual circuit boards (10) by pre-forming holes (18) through circuitry (14,16) etched on opposite sides of a substrate (12). The holes (18) are next selectively plated with a conductive layer (20) and then with a material (24) capable of forming a melted fusion bond and/or a solid-state fusion bond. Bonding film (56) is placed between each board-to-board interface of a multi-board assembly and the assembly of boards is subjected to a bonding cycle of heat and pressure wherein an integral unit is effected.
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