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Abstract

Piperazine containing positive photoresist stripping compositions are provided. Formulations include N-aminoalkylpiperazines with the formula ##STR1## bis-N-aminoalkylpiperazines of the formula ##STR2## N-hydroxyalkylpiperazine of the formula ##STR3## and bis-hydroxyalkypiperazines with structure ##STR4## In the above formulae n=1-6. Also included are piperazine derivatives such as those of the above formulae with a branch chain alkyl of 1-6 C atoms, and 5-6 atom cycloalkyl substituted compounds wherein the cycloalkyl is substituted for --(CH.sub.2).sub.n --. Components which may be mixed with the above described piperazine in preparing the positive photoresist stripping compositions of the invention include alkyl or cycloalkyl-2-pyrrolidones of the formula ##STR5## Other amide type solvents with the boiling point in excess of 200.degree. C. as well as high boiling diethylene glycol ethers may also be incorporated.

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First Claim