Thermal technique for simultaneous testing of circuit board solder joints
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United States of America Patent
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Dec 20, 1988
Grant Date -
N/A
app pub date -
Jan 16, 1987
filing date -
Jan 16, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A system for inspecting the electronic integrity of solder joints by repetitive pulse-heating the solder joints with radiant energy and determining the temperature oscillation of pulse-heated solder joints by measuring the infrared emissions from the solder joints during heating and non-heating periods. Advantageously, the exposed solder joints of a circuit board can be tested all at one time by pulse-heating the entire circuit board. The temperature oscillation of each joint can be compared to the temperature oscillations of corresponding standard solder joints of known good electronic integrity on properly operating boards.
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