Cermet substrate with spinel adhesion component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 27, 1988
Issued Date -
N/A
app pub date -
Dec 31, 1987
filing date -
Mar 12, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is directed to a cermet material comprising a matrix of aluminum alloy with ceramic particles distributed therein. The cermet is adapted for use as a semiconductor substrate and is manufactured using powder technology procedures. The cermet comprises from about 40 to about 60 volume % of aluminum or aluminum alloy, from an effective amount up to about 10 volume % of binder for enhancing bonding between the aluminum alloy and ceramic particles, and the balance essentially ceramic particles.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully