Metallized polymer compositions, processes for their preparation and their uses
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United States of America Patent
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Jan 3, 1989
Grant Date -
N/A
app pub date -
May 8, 1986
filing date -
May 10, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Metallized polymer compositions are disclosed, the surface of which comprises an intermetallic compound of a metal element A (Sn, As, Sb or Bi) and a metal element B (Fe, Co, Ni, Cu, Zn, Ga, Ru, Rh, Pd, Ag, Cd or In), preferably an intermetallic compound of antimony and a metal element B. Processes for producing such metallized polymer compositions involve either the reduction of a metal element A compound in the presence of metallic metal element B and the polymer or the compression of a laminate of metal element A and metal element B layers onto the polymer. The metallized polymers are useful in the production of printing circuit boards, electromagnetic interference shielding devices, membrane switches, capacitors, conductive fibers, magnetic tapes and disc, antistatic mats, barrier polymers and optical storage devices.
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