Peripheral/area wire bonding technique
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United States of America Patent
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-
Jan 3, 1989
Grant Date -
N/A
app pub date -
Jun 15, 1987
filing date -
Jun 15, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the first and second lead frames.
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