Integrated circuit with improved monitoring function by use of built-in elements
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United States of America Patent
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Jan 24, 1989
Grant Date -
N/A
app pub date -
Sep 6, 1985
filing date -
Sep 6, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor integrated circuit of the type having at least one reference element fabricated on a semiconductor chip on which functional elements are formed is obtained by a high integration structure. The reference element is coupled through a switching element to a bonding pad to which a part of the functional elements is connected. The switching element assumes a non-conductive state when the functional elements operate and a conductive state when a voltage applied thereto is outside the normal operating voltage of the functional elements.
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