Printed circuit board capable of preventing electromagnetic interference

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United States of America Patent

PATENT NO 4801489
SERIAL NO

07025106

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A printed circuit board capable of preventing electromagnetic interference comprises a base plate composed of an insulating material. On the main surface of the base plate, a first electric conductive layer is formed by etching copper foil, which includes a signal electrode portion and a ground electrode portion. On the first electric conductive layer, an insulating layer such as a solder resist film is formed except for a part of the ground electrode portion, and on this layer, a second electric conductive layer is formed by screen-printing a copper ink so as to cover almost all of the first electric conductive layer. A part of the second electric conductive layer is connected to the ground electrode portion of the first electric conductive layer so that the second electric conductive layer acts as an electromagnetic shield. The copper ink is a mixture of copper powder, binder and other materials. A solder layer may be formed on the second electric conductive layer composed of the copper ink.

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Patent Owner(s)

Patent OwnerAddress
NINTENDO CO LTD 60 FUKUINE KAMITAKAMATSU-CHO HIGASHIYAMA-KU KYOTO JAPANNot Provided
TATSUTA ELECTRIC WIRE & CABLE CO LTD 3-1 IWATA-CHO 2-CHOME HIGASHIOSAKA-SHI OSAKA-FU JAPANNot Provided

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eguchi, Kazumasa Higashiosaka, JP 2 74
Murakami, Hisatoshi Higashiosaka, JP 9 211
Nakagawa, Katsuya Kyoto, JP 57 2254
Nakatani, Fumio Higashiosaka, JP 5 114
Terada, Tsunehiko Higashiosaka, JP 14 210
Wakita, Shinichi Higashiosaka, JP 12 229

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