Double wall fast cool-down furnace

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4802441
SERIAL NO

07001444

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Abstract

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One fast cool-down furnace embodiment discloses a double wall in the interspace of which a cooling air stream is flowable to provide fast cool-down of a load of wafers. The double wall embodiment is retrofittable on existing diffusion furnaces, and includes a cylindrical member aligned in concentric relation with the diffusion tube by combination plenum defining and supporting manifolds. In a second embodiment, the fast cool-down furnace includes a reaction vessel and a heating core relatively movable relative to each other in such a way that in a fast cool-down condition the core and reaction vessel are spaced apart. Cooling tubes are embedded in the movable core. Fans or other aids to cooling are provided. Operation is either in a controlled cool-down mode or in a quick quench mode.

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Patent Owner(s)

Patent OwnerAddress
KOKUSAI SEMICONDUCTOR EQUIPMENT CORPORATION1957 CONCOURSE DRIVE SUITE C SAN JOSE CA 95131-1708

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Waugh, Arthur Winchester, MA 7 1323

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