Method for cold bonding

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4804132
SERIAL NO

07090608

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is a method for bonding two surfaces without applying heat. The surfaces are prepared so that they both have an outermost layer of aluminum. One of the surfaces has metallized particles that protrude at the desired bonding points. When the two surfaces are brought into contact, the particles pierce the aluminum surface, displacing any aluminum oxide that may be present. This provides two virgin aluminum surfaces on contact with each other, which allows the formation of a metal matrix, thus bonding the two surfaces. The strength of the bond can be controlled by varying the piercing depth and size of the particles. The material for the particles may be chosen so that the bond is both electrically and thermally conductive, either electrically or thermally conductive, or both electrically and thermally insulative.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NANOPIERCE TECHNOLOGIES, INC.DENVER, CO4

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DiFrancesco, Louis 31032 Hershey Way, Hayward, CA 94549 15 677

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* Cited By Examiner