US Patent No: 4,804,132

Number of patents in Portfolio can not be more than 2000

Method for cold bonding

1 Status Updates

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present invention is a method for bonding two surfaces without applying heat. The surfaces are prepared so that they both have an outermost layer of aluminum. One of the surfaces has metallized particles that protrude at the desired bonding points. When the two surfaces are brought into contact, the particles pierce the aluminum surface, displacing any aluminum oxide that may be present. This provides two virgin aluminum surfaces on contact with each other, which allows the formation of a metal matrix, thus bonding the two surfaces. The strength of the bond can be controlled by varying the piercing depth and size of the particles. The material for the particles may be chosen so that the bond is both electrically and thermally conductive, either electrically or thermally conductive, or both electrically and thermally insulative.

Loading the Abstract Image... loading....

First Claim

See full text

all claims..

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
NANOPIERCE TECHNOLOGIES, INC.DENVER, CO4

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Difrancesco, Louis Hayward, CA 15 556

Cited Art Landscape

  • No Cited Art to Display

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
TESSERA, INC. (38)
7,462,936 Formation of circuitry with modification of feature height 2 2004
8,207,604 Microelectronic package comprising offset conductive posts on compliant layer 2 2004
7,709,968 Micro pin grid array with pin motion isolation 1 2004
7,176,043 Microelectronic packages and methods therefor 9 2004
7,453,157 Microelectronic packages and methods therefor 11 2005
7,495,179 Components with posts and pads 2 2005
8,525,314 Stacked packaging improvements 1 2005
7,939,934 Microelectronic packages and methods therefor 0 2005
8,067,267 Microelectronic assemblies having very fine pitch stacking 1 2005
8,058,101 Microelectronic packages and methods therefor 3 2005
7,545,029 Stack microelectronic assemblies 6 2006
7,554,206 Microelectronic packages and methods therefor 5 2006
8,641,913 Fine pitch microcontacts and method for forming thereof 1 2007
7,745,943 Microelectonic packages and methods therefor 8 2007
7,816,251 Formation of circuitry with modification of feature height 2 2008
8,046,912 Method of making a connection component with posts and pads 0 2009
8,114,711 Method of electrically connecting a microelectronic component 0 2009
8,513,799 Method of electrically connecting a microelectronic component 0 2009
8,148,199 Method of electrically connecting a microelectronic component 0 2009
8,531,039 Micro pin grid array with pin motion isolation 0 2010
8,093,697 Microelectronic packages and methods therefor 17 2010
7,999,397 Microelectronic packages and methods therefor 2 2010
8,330,272 Microelectronic packages with dual or multiple-etched flip-chip connectors 4 2010
8,482,111 Stackable molded microelectronic packages 1 2010
8,580,607 Microelectronic packages with nanoparticle joining 1 2010
8,148,205 Method of electrically connecting a microelectronic component 0 2010
8,531,020 Stacked packaging improvements 0 2010
8,884,448 Flip chip interconnection with double post 0 2010
8,853,558 Interconnect structure 0 2010
8,728,865 Microelectronic packages and methods therefor 0 2011
8,604,348 Method of making a connection component with posts and pads 0 2011
8,329,581 Microelectronic packages and methods therefor 1 2011
8,872,318 Through interposer wire bond using low CTE interposer with coarse slot apertures 0 2011
8,637,991 Microelectronic package with terminals on dielectric mass 0 2011
8,623,706 Microelectronic package with terminals on dielectric mass 0 2011
8,659,164 Microelectronic package with terminals on dielectric mass 2 2012
8,723,318 Microelectronic packages with dual or multiple-etched flip-chip connectors 0 2012
8,907,466 Stackable molded microelectronic packages 0 2013
 
SV PROBE PTE LTD. (7)
* 5,402,077 Bare die carrier 54 1992
* 5,623,213 Membrane probing of circuits 94 1996
* 5,847,571 Membrane probing of circuits 23 1996
* 5,841,291 Exchangeable membrane probe testing of circuits 18 1996
* 5,973,504 Programmable high-density electronic device testing 99 1997
6,245,445 Rough electrical contact surface 4 1999
6,937,044 Bare die carrier 3 2000
 
MICRON TECHNOLOGY, INC. (6)
* 5,929,521 Projected contact structure for bumped semiconductor device and resulting articles and assemblies 56 1997
6,291,897 Carriers including projected contact structures for engaging bumped semiconductor devices 18 1999
6,613,662 Method for making projected contact structures for engaging bumped semiconductor devices 44 2001
7,115,495 Methods of making projected contact structures for engaging bumped semiconductor devices 13 2003
7,205,661 Projected contact structures for engaging bumped semiconductor devices and methods of making the same 6 2005
7,161,250 Projected contact structures for engaging bumped semiconductor devices and methods of making the same 1 2005
 
INVENSAS CORPORATION (5)
8,836,136 Package-on-package assembly with wire bond vias 0 2012
8,404,520 Package-on-package assembly with wire bond vias 1 2012
8,835,228 Substrate-less stackable package with wire-bond interconnect 0 2012
8,878,353 Structure for microelectronic packaging with bond elements to encapsulation surface 0 2012
8,883,563 Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation 0 2014
 
NANOPIERCE TECHNOLOGIES, INC. (5)
* 5,334,809 Particle enhanced joining of metal surfaces 19 1993
* 5,565,280 Electrical interconnect using particle enhanced joining of metal surfaces 10 1995
* 5,506,514 Electrical interconnect using particle enhanced joining of metal surfaces 36 1995
* 5,835,359 Electrical interconnect using particle enhanced joining of metal surfaces 14 1996
6,630,203 Electroless process for the preparation of particle enhanced electric contact surfaces 11 2001
 
AMERICAN VEHICULAR SCIENCES LLC (4)
6,326,704 Vehicle electrical system 31 1999
6,533,316 Automotive electronic safety network 70 2001
6,648,367 Integrated occupant protection system 74 2001
6,733,036 Automotive electronic safety network 67 2001
 
GENERAL ELECTRIC COMPANY (2)
7,375,420 Large area transducer array 4 2004
7,867,824 Methods of fabricating a large area transducer array 0 2008
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (2)
* 5,267,867 Package for multiple removable integrated circuits 28 1992
* 5,456,404 Method of testing semiconductor chips with reusable test package 29 1993
 
STOVOKOR TECHNOLOGY LLC (2)
* 5,170,930 Liquid metal paste for thermal and electrical connections 81 1991
* 5,328,087 Thermally and electrically conductive adhesive material and method of bonding with same 88 1993
 
THOMAS & BETTS INTERNATIONAL, INC. (2)
* 5,600,099 Chemically grafted electrical devices 10 1994
* 5,949,029 Conductive elastomers and methods for fabricating the same 20 1996
 
ALCAN INTERNATIONAL LIMITED (1)
* 5,316,863 Self-brazing aluminum laminated structure 16 1992
 
AMKOR ELECTRONICS, INC. (1)
* 5,829,988 Socket assembly for integrated circuit chip carrier package 64 1996
 
BAHL, KENNETH S. (1)
* 5,083,697 Particle-enhanced joining of metal surfaces 110 1990
 
DIFRANCESCO, LOUIS (1)
6,284,108 Method and apparatus for momentum plating 3 1998
 
FURUKAWA-SKY ALUMINUM CORP. (1)
* 6,557,747 Highly gas tight chamber and method of manufacturing same 5 2001
 
GENESIS MICROCHIP INC. (1)
* 8,191,756 Hermetically sealing using a cold welded tongue and groove structure 1 2005
 
KULICKE & SOFFA HOLDINGS, LLC (1)
* 5,876,580 Rough electrical contact surface 22 1996
 
MAGNACHIP SEMICONDUCTOR, LTD. (1)
* 5,428,298 Probe structure for testing a semiconductor chip and a press member for same 17 1994
 
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION (1)
* 5,445,308 Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal 59 1994
 
STRYKER TECHNOLOGIES CORPORATION (1)
* 5,634,265 Electrical interconnect using particle enhanced joining of metal surfaces 10 1995
 
TERADYNE, INC. (1)
* 5,880,591 System for circuit modules having a plurality of independently positionable probes 1 1996
 
The Boeing Company (1)
* 7,871,040 Composite aircraft structures with hat stiffeners 17 2006
 
Other [Check patent profile for assignment information] (3)
* 5,110,293 Neckless blade implant 1 1988
* 5,102,336 Neckless blade implant 4 1989
* 5,812,925 Low temperature bonding of materials 13 1996
* Cited By Examiner