US Patent No: 4,804,132

Number of patents in Portfolio can not be more than 2000

Method for cold bonding

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Abstract

The present invention is a method for bonding two surfaces without applying heat. The surfaces are prepared so that they both have an outermost layer of aluminum. One of the surfaces has metallized particles that protrude at the desired bonding points. When the two surfaces are brought into contact, the particles pierce the aluminum surface, displacing any aluminum oxide that may be present. This provides two virgin aluminum surfaces on contact with each other, which allows the formation of a metal matrix, thus bonding the two surfaces. The strength of the bond can be controlled by varying the piercing depth and size of the particles. The material for the particles may be chosen so that the bond is both electrically and thermally conductive, either electrically or thermally conductive, or both electrically and thermally insulative.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NANOPIERCE TECHNOLOGIES, INC.DENVER, CO14

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Difrancesco, Louis Hayward, CA 15 503

Cited Art

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Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
TESSERA, INC. (21)
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8,207,604 Microelectronic package comprising offset conductive posts on compliant layer 0 2004
7,709,968 Micro pin grid array with pin motion isolation 0 2004
7,176,043 Microelectronic packages and methods therefor 7 2004
7,453,157 Microelectronic packages and methods therefor 7 2005
7,495,179 Components with posts and pads 1 2005
7,939,934 Microelectronic packages and methods therefor 0 2005
8,067,267 Microelectronic assemblies having very fine pitch stacking 0 2005
8,058,101 Microelectronic packages and methods therefor 1 2005
7,545,029 Stack microelectronic assemblies 4 2006
7,554,206 Microelectronic packages and methods therefor 4 2006
7,745,943 Microelectonic packages and methods therefor 1 2007
7,816,251 Formation of circuitry with modification of feature height 2 2008
8,046,912 Method of making a connection component with posts and pads 0 2009
8,114,711 Method of electrically connecting a microelectronic component 0 2009
8,148,199 Method of electrically connecting a microelectronic component 0 2009
8,093,697 Microelectronic packages and methods therefor 3 2010
7,999,397 Microelectronic packages and methods therefor 0 2010
8,330,272 Microelectronic packages with dual or multiple-etched flip-chip connectors 0 2010
8,148,205 Method of electrically connecting a microelectronic component 0 2010
8,329,581 Microelectronic packages and methods therefor 0 2011
 
SV PROBE PTE LTD. (7)
5,402,077 Bare die carrier 54 1992
5,623,213 Membrane probing of circuits 92 1996
5,847,571 Membrane probing of circuits 22 1996
5,841,291 Exchangeable membrane probe testing of circuits 18 1996
5,973,504 Programmable high-density electronic device testing 97 1997
6,245,445 Rough electrical contact surface 4 1999
6,937,044 Bare die carrier 3 2000
 
MICRON TECHNOLOGY, INC. (6)
5,929,521 Projected contact structure for bumped semiconductor device and resulting articles and assemblies 46 1997
6,291,897 Carriers including projected contact structures for engaging bumped semiconductor devices 16 1999
6,613,662 Method for making projected contact structures for engaging bumped semiconductor devices 32 2001
7,115,495 Methods of making projected contact structures for engaging bumped semiconductor devices 4 2003
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7,161,250 Projected contact structures for engaging bumped semiconductor devices and methods of making the same 0 2005
 
NANOPIERCE TECHNOLOGIES, INC. (5)
5,334,809 Particle enhanced joining of metal surfaces 19 1993
5,565,280 Electrical interconnect using particle enhanced joining of metal surfaces 10 1995
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6,630,203 Electroless process for the preparation of particle enhanced electric contact surfaces 9 2001
 
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HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (2)
5,267,867 Package for multiple removable integrated circuits 24 1992
5,456,404 Method of testing semiconductor chips with reusable test package 29 1993
 
STOVOKOR TECHNOLOGY LLC (2)
5,170,930 Liquid metal paste for thermal and electrical connections 78 1991
5,328,087 Thermally and electrically conductive adhesive material and method of bonding with same 86 1993
 
THOMAS & BETTS INTERNATIONAL, INC. (2)
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5,316,863 Self-brazing aluminum laminated structure 15 1992
 
AMKOR ELECTRONICS, INC. (1)
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BAHL, KENNETH S. (1)
5,083,697 Particle-enhanced joining of metal surfaces 86 1990
 
DIFRANCESCO, LOUIS (1)
6,284,108 Method and apparatus for momentum plating 3 1998
 
FURUKAWA-SKY ALUMINUM CORP. (1)
6,557,747 Highly gas tight chamber and method of manufacturing same 4 2001
 
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8,191,756 Hermetically sealing using a cold welded tongue and groove structure 0 2005
 
INVENSAS CORPORATION (1)
8,404,520 Package-on-package assembly with wire bond vias 0 2012
 
KULICKE & SOFFA HOLDINGS, LLC (1)
5,876,580 Rough electrical contact surface 22 1996
 
MAGNACHIP SEMICONDUCTOR, LTD. (1)
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MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION (1)
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STRYKER TECHNOLOGIES CORPORATION (1)
5,634,265 Electrical interconnect using particle enhanced joining of metal surfaces 10 1995
 
TERADYNE, INC. (1)
5,880,591 System for circuit modules having a plurality of independently positionable probes 1 1996
 
THE BOEING COMPANY (1)
7,871,040 Composite aircraft structures with hat stiffeners 7 2006
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (3)
5,110,293 Neckless blade implant 1 1988
5,102,336 Neckless blade implant 3 1989
5,812,925 Low temperature bonding of materials 9 1996