US Patent No: 4,804,132

Number of patents in Portfolio can not be more than 2000

Method for cold bonding

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Abstract

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The present invention is a method for bonding two surfaces without applying heat. The surfaces are prepared so that they both have an outermost layer of aluminum. One of the surfaces has metallized particles that protrude at the desired bonding points. When the two surfaces are brought into contact, the particles pierce the aluminum surface, displacing any aluminum oxide that may be present. This provides two virgin aluminum surfaces on contact with each other, which allows the formation of a metal matrix, thus bonding the two surfaces. The strength of the bond can be controlled by varying the piercing depth and size of the particles. The material for the particles may be chosen so that the bond is both electrically and thermally conductive, either electrically or thermally conductive, or both electrically and thermally insulative.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NANOPIERCE TECHNOLOGIES, INC.DENVER, CO4

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DiFrancesco, Louis 31032 Hershey Way, Hayward, CA 94549 15 641

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Patent Info (Count) # Cites Year
 
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8,330,272 Microelectronic packages with dual or multiple-etched flip-chip connectors 11 2010
9,159,708 Stackable molded microelectronic packages with area array unit connectors 0 2010
8,482,111 Stackable molded microelectronic packages 24 2010
8,580,607 Microelectronic packages with nanoparticle joining 2 2010
8,148,205 Method of electrically connecting a microelectronic component 0 2010
8,531,020 Stacked packaging improvements 0 2010
8,884,448 Flip chip interconnection with double post 1 2010
8,853,558 Interconnect structure 0 2010
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9,093,435 Package-on-package assembly with wire bonds to encapsulation surface 0 2013
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8,907,466 Stackable molded microelectronic packages 0 2013
8,927,337 Stacked packaging improvements 11 2013
9,030,001 Microelectronic packages with nanoparticle joining 0 2013
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9,324,681 Pin attachment 0 2014
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9,023,691 Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation 0 2013
9,252,122 Package-on-package assembly with wire bond vias 0 2013
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8,883,563 Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation 7 2014
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9,356,006 Batch process fabrication of package-on-package microelectronic assemblies 0 2015
 
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION (1)
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* Cited By Examiner