Electro-nickel plating activator composition, a method for using and a capacitor made therewith
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United States of America Patent
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Feb 21, 1989
Grant Date -
N/A
app pub date -
Jul 16, 1987
filing date -
Jul 16, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plating activator composition that is largely silver is applied in a thin film to two surface areas of a ceramic chip capacitor. Subsequently, many such chip capacitors are electrolytically nickel plated, e.g. are electro-nickel barrel plated to provide two strongly adhered nickel terminals to the component. This activator composition consists essentially of at elast 85% Ag, from 0.1 to 7% Pd, from 1% to 10% of an element selected from Cu, Si, Bi, Zn, Fe, Ni, Sn, Zr, Nb, Sb, Mn and combinations thereof. These terminals are strong, truly conformal and are highly manufacturable.
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