Method of connecting electronic element to base plate
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United States of America Patent
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-
Mar 21, 1989
Grant Date -
N/A
app pub date -
Mar 29, 1988
filing date -
Apr 3, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic element is connected to a base plate provided with a metallic pattern and a conductive resist layer superposed thereon by a thermal compression process with an adhesive layer sandwiched between the element and the base plate. The adhesive layer contains many metallic particles which are larger than the layer thickness of the resist such that these metallic particles penetrate the resist layer and invade the metallic pattern by the thermal compression process.
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