Mounting of semiconductor chips on a plastic substrate
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United States of America Patent
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-
Mar 21, 1989
Grant Date -
N/A
app pub date -
Nov 26, 1986
filing date -
Nov 26, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip mounting is provided by molding a substrate of heat resistant synthetic resin, forming contact pads, which may be protrusions or recesses, on a surface of the substrate as it is molded. A circuit pattern extends to the contact pads which have a conductive surface. The chip is directly mounted on the substrate by soldering contact areas on the chip to the contact pads on the substrate, thus avoiding wire bonding.
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