Method of fabricating image sensor dies for use in assembling arrays
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United States of America Patent
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-
Mar 21, 1989
Grant Date -
N/A
app pub date -
Aug 28, 1987
filing date -
Aug 28, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves defining the die faces, relatively wide grooves are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side of the saw blade facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.
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