Surface mounted electronic device with selectively solderable leads
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United States of America Patent
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-
Mar 21, 1989
Grant Date -
N/A
app pub date -
Feb 17, 1988
filing date -
Feb 17, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A surface mounted device (SMD) having leads selectively solderable so that those portions of the leads extending down along the sides of the device body are not solderable. Thus, during attachment to a mother board by wave soldering, solder does not collect in the spaces between the leads and the device body, and both solder joint reliability and strength are improved.
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