Ultrasonic wire bonding quality monitor and method
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United States of America Patent
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-
Mar 21, 1989
Grant Date -
N/A
app pub date -
May 30, 1986
filing date -
May 30, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A bond quality monitor and method for monitoring and analyzing the relative quality of bonding operations performed by ultrasonic bonding machines is disclosed. The bond quality monitor (40) includes an analog bond monitoring circuit (42) and a digital microcomputer (44). The bond monitoring circuit, which is placed in series between an ultrasonic signal generator (26) and its corresponding ultrasonic transducer (18), monitors the transducer power signal generated by the ultrasonic signal generator and performs a series of analog computations based on the logarithm of the impedance of the transducer in order to create a measure of bond quality. The microcomputer controls the operation of the bond monitoring circuit and performs comparisons to determine bond quality relative to previously monitored good quality bonds.
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