Process for manufacturing plastic pin grid arrays and the product produced thereby
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United States of America Patent
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-
Mar 28, 1989
Issued Date -
N/A
app pub date -
May 21, 1987
filing date -
Feb 19, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.
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