Method of manufacturing printed circuit boards
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United States of America Patent
Stats
-
Apr 4, 1989
Grant Date -
N/A
app pub date -
Jun 9, 1986
filing date -
Jun 10, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a method of manufacturing printed circuit boards. The method of manufacturing printed circuit boards under the present invention is to provide holes on a metal plate, to attach a prepreg to the metal plate, and to fill the prepreg into the holes by heat-pressing the metal plate to which the prepreg is attached. Thereafter, lead wire holes are provided at the centers of prepreg filled the holes, and a resin plate having at least one circuit layer and through holes is glued to the metal plate. Alternately, a resin plate having at least one circuit layer and lead wire holes, or a resin plate having at least one circuit layer, through holes and lead wire holes are glued to the metal plate on the side where the prepreg is attached.
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