Repairable flip-chip bumping
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United States of America Patent
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-
Apr 4, 1989
Grant Date -
N/A
app pub date -
Mar 28, 1988
filing date -
Mar 28, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A substrate contact structure which includes a plurality of contact pads formed on a surface of the substrate and located for receiving a predetermined integrated circuit chip or die having conductive bonding bumps corresponding to and respectively associated with the plurality of contact pads. Each of the contact pads includes a plurality of bonding sites, wherein the pattern of bonding sites is substantially identical for each of the contact pads. Each bonding site has corresponding bonding sites on the other contact pads which cooperatively form sets of bonding sites, each of which is a mirror image of the conductive bonding bumps on the predetermined integrated circuit chip. Methods of producing substrates suitable for removal and replacement of bump bonded integrated circuit chips, as well as methods of repair of such structures are also disclosed.
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