Importance

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Abstract

A process for drilling chamfered holes includes the steps of directing noncontact energy onto the outer surface of the part to form a recessed crater-like entrance with chamfered walls and thereafter directing a small diameter wire electrode adjacent the substrate and spark eroding the base without removing material from the chamfered walls so as to produce a combined passage through the part with a chamfered entrance leading to a smaller outlet. In one embodiment the part has a ceramic coating which is initially removed from the part by either focusing a laser beam to a penetration depth which removes the ceramic coating while forming the entrance and in another embodiment the coating is initially removed by imposing a high voltage pulse thereagainst from a spark erosion electrode of electrical discharge machining equipment.

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First Claim