Iridium/platinum implant, method of encapsulation, and method of implantation

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United States of America Patent

PATENT NO 4819618
SERIAL NO

07024663

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A IR-192 platinum wire implant includes a core area 0.1 mm in diameter, comprised of 25 percent iridium and 75 percent platinum. This core area is encased in a 100 percent platinum sheath of 0.15 mm thickness in cross-section and 0.075 mm thickness at its end portions. Therefore, the entire implant insert is 0.4 mm in diameter. Further, the iridium/platinum composite implant includes means for allowing it to be cut to any length desired so that cutting of the composite metal through cross-section would effectively squeeze the 0.15 mm sheath coating around the end portion of the iridium/platinum core and effectively achieve the 0.075 mm thickness at the end portion, thus sealing the end portion of the implant . There would further be provided a method for achieving the cutting of the composite implants to various pre-determined lengths and maintaining the sealed end portions upon completion of the cut. There is further provided the step of arc welding a flexible housing to an inner stainless steel guide member to which the implant is bonded in order to provide a continuous flexible guide for the implant.

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Patent Owner(s)

Patent OwnerAddress
INTERVENTIONAL THERAPIES LLCONE GORHAM ISLAND WESTPORT CT 06880

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liprie, Sam F P.O. Box 834, Lake Charles, LA 70602-0834 14 1048

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