Enhanced evaporator surface
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United States of America Patent
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-
Apr 11, 1989
Grant Date -
N/A
app pub date -
Jan 20, 1987
filing date -
Jan 20, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An enhanced capillary assisted evaporative surface for use in heat transfer devices; such as, 2-phase mounting plates, heat pipes and collectors. Rectangular grooves are cut in a conductive substrate and then plated by vapor deposition. The process produces a necked-down opening in the groove and a dendritic surface improving both capillary pumping and heat transfer coefficients.
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