Strip line circuit component and method of manufacture
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United States of America Patent
Stats
-
Apr 11, 1989
Grant Date -
N/A
app pub date -
Feb 6, 1987
filing date -
Feb 6, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved strip line component and method of manufacture are disclosed that permit strip line circuits to be packaged in component form and to be soldered directly to conventional circuit boards. Electrical contact pads are formed on the side of the strip line component during fabrication by drilling holes through the multilayer laminar assembly and plating the holes with a conductive material. The laminar assembly is then cut along lines that intersect the holes, thereby exposing plated indentations along the sides of the cut component. The component so cut can then be soldered to a circuit board using the plated indentations. The method is well adapted to the economical manufacture of large numbers of identical components.
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