Auto-selective metal deposition on dielectric surfaces
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United States of America Patent
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Apr 18, 1989
Issued Date -
N/A
app pub date -
Jul 7, 1986
filing date -
Jan 17, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of plating a pattern of metal (e.g. copper or nickel) on a dielectric surface, i.e. surface of a dielectric material such as a synthetic resin or ceramic. The method comprises the preliminary step of masklessly treating the dielectric surface to selectively activate preselected areas thereof so that the dielectric surface in contact with a priming solution becomes catalytic, and thereby receptive to electroless metal deposition, selectively at those areas. The treated dielectric surface is contacted with an electroless plating solution to allow metal therefrom to auto-reductively deposit selectively at those catalized areas, thereby forming the pattern of metal desired on the dielectric surface.
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