Semiconductor device and its manufacture
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United States of America Patent
Stats
-
Apr 18, 1989
Grant Date -
N/A
app pub date -
Jul 1, 1986
filing date -
Aug 16, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package. The one surface of the heat sink is being bared from one side of the package, and the semiconductor chips are being mounted on the other surface of the heat sink facing to the opening of the substrate.
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