Forming plated through holes in a printed circuit board by using a computer controlled plotter
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United States of America Patent
Stats
-
Apr 18, 1989
Issued Date -
N/A
app pub date -
Nov 10, 1986
filing date -
Apr 16, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Plated through holes in a printed circuit board can be conveniently produced during manufacture of the circuit board under the control of a computer controlled plotter by the use of a pen-like instrument which positively displaces a thick film fluid conductive adhesive on a tip of the instrument. The fluid is smeared onto the side walls of the hole by moving the tip in a peripheral motion around the side wall of the hole. Copper is electroplated directly onto the conductive adhesive. Resist material is applied in a similar fashion prior to etching the circuit traces on the surface sheets of the circuit board.
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- Non-US Classification not provided for expired patents
Cited Art Landscape
Patent Citation Ranking
- Citation Ranking not provided for expired patents
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