Ultra-thin solar cell and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 25, 1989
Grant Date -
N/A
app pub date -
Feb 2, 1988
filing date -
Feb 2, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for processing solar cells, and particularly thin solar cells is disclosed. The method contemplates processing the front surface of the cell on a wafer of normal thickness. A transparent substrate is adhered to the front of the processed cell. The bulk semiconductor layer is then thinned to the desired thickness. An amorphous doped semiconductor material is applied to the back surface of the thinned wafer and exposed to pulsed laser energy having a duration and intensity long enough to melt the amorphous material, but short enough to prevent thermal damage to the bondline. A back surface dielectric, backside contact mask and back surface reflector metal complete the cell.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully