Wafer probe
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United States of America Patent
Stats
-
May 2, 1989
Grant Date -
N/A
app pub date -
Jan 30, 1987
filing date -
Jan 30, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer probe for accessing bonding pads on a planar device includes contact pads mounted on one edge of the under side of a dielectric substrate board and arranged to align with the bonding pads to be accessed. Coplanar ground and signal conductors deposited on the under side of the substrate board form constant impedance transmission lines for connecting test equipment to the contact pads. A ground contact is mounted on the upper side of the substrate near the end on which the contact pads are mounted, the ground contact being connected by a conductive path to the ground conductors on the under side of the substrate. When two such wafer probes simultaneously access bonding pads on the same planar device, the ground conductors of the two probes are interconnected by a conductive sheet of foil extending between the ground contacts on the upper sides of the substrates of both wafer probes.
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