Compliant S-leads for chip carriers
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United States of America Patent
Stats
-
May 9, 1989
Grant Date -
N/A
app pub date -
Mar 28, 1988
filing date -
Mar 28, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A compliant S-shaped lead for resiliently supporting an integrated circuit chip package in spaced relation generally parallel to a printed circuit board. The S-lead bends and twists to absorb forces which would otherwise be exerted on solder joints due to temperature cycling and vibration. The symmetrical S-lead self-centers on both the package and PC board to provide minimum stress. The leads are held by a support strip for connection to the chip carrier. Thereafter, the support strip is removed and the carrier positions the leads for connection to the circuit board.
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