Thermoelectric module optimized for low temperature difference
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United States of America Patent
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May 9, 1989
Grant Date -
N/A
app pub date -
Sep 2, 1987
filing date -
Sep 2, 1987
priority date (Note) -
Expired
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Abstract
A structure for joining thermoelectric and heat exchange elements in series so that the combination can be operated as a heat pump, at an elevated voltage with high efficiency when transporting high heat flux levels across very small temperature differences.
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