Method of applying small drop-shaped quantities of melted solder from a nozzle to surfaces to be wetted and device for carrying out the method
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United States of America Patent
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-
May 9, 1989
Grant Date -
N/A
app pub date -
Nov 4, 1987
filing date -
Nov 5, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a method of applying small quantities of melted solder from a nozzle to surfaces to be wetted, which are then solidified, the solder is caused to melt by heating and is propelled by means of a piezoelectric transducer used as a pressure generator from a delivery nozzle in the form of droplets onto the area to be wetted.
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Cited Art Landscape
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