Solderless circuit connection for bowed circuit board
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United States of America Patent
Stats
-
May 23, 1989
Grant Date -
N/A
app pub date -
Nov 27, 1987
filing date -
Nov 27, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An elastomer pad which applies a compressive force against a flexible printed circuit to bias substantially parallel terminal portions of the printed circuit into electrical contact with substantially parallel terminal portions of a hardboard printed circuit is supported by an arched rib-like member to provide a uniform force at the respective locations of electrical contact. This assures a uniform impedance from one pair of contacting terminal portions to the next pair should the hardboard printed circuit be slightly bowed crosswise of its terminal portions by the compressive force of the elastomer pad.
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