Plastic electrically insulating substrates for wiring circuit boards and a method of manufacturing thereof
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United States of America Patent
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-
Jun 6, 1989
Grant Date -
N/A
app pub date -
Mar 30, 1987
filing date -
Mar 30, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plastic electrically insulating substrate, having high thermal conductivity, for wiring circuit boards including a substrate having a front surface for mounting an electrical device back surface. The substrate is made of a laminate of a plurality of oriented sheets of one or more semicrystalline polymers having a uniform oriented direction of the sheets, and wherein the oriented direction of the sheets is arranged in the direction of the substrate thickness.
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