Vapour phase treatment process and apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 13, 1989
Grant Date -
N/A
app pub date -
Nov 12, 1987
filing date -
Nov 12, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for treating workpieces in a normally closed treatment chamber. The process comprises providing a pressure within the chamber which is less than atmospheric and providing an unsaturated treatment vapor within the chamber. A workpiece is then moved into the chamber to be treated by the unsaturated vapor. The process is particularly suited for the vapor phase soldering of printed circuit boards. The unsaturated vapor in the chamber is heated to a temperature higher than the melting point of the solder used and the circuit boards with solder thereon are passed through the vapor in the chamber to reflow the solder. The invention is also directed toward an apparatus for carrying out the process.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully