Apparatus for processing substrate surface

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United States of America Patent

PATENT NO 4838979
SERIAL NO

07098476

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Abstract

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An improved processing apparatus for a substrate surface, which provides uniform and smooth air flows A within the processing chamber 26, by which an even thin film of a processing solution can be formed on the substrate surface. Undersirable surplus processing solution is collected primarily in a first chamber 13. A second chamber 15 is provided which is separate from the first chamber and pneumatically communicated therewith through a slit 16.

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Patent Owner(s)

Patent OwnerAddress
DAINIPPON SCREEN MFG CO LTD 1-1 TENJINKITAMACHI TERANOUCHI-AGARU 4-CHOME HORIKAWA-DORI KAMIKYO-KU KYOTO 602 JAPANNot Provided

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nishida, Masami Kyoto, JP 62 1649
Orgami, Nobutoshi Shiga, JP 3 135

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