Method and apparatus for applying solder preforms
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United States of America Patent
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-
Jun 27, 1989
Grant Date -
N/A
app pub date -
Jun 23, 1988
filing date -
Jun 23, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of applying solder to contacts of a connector, when the contacts are spaced apart according to a given arrangement. The method includes the steps of perforating a water-soluble adhesive material to form perforations in a pattern according to the given arrangement, applying solder preforms around the perforations, positioning the adhesive material to center the solder preforms around the contacts, washing off the adhesive material with water, and heating the contacts to the flow-point temperature of the solder.
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