Connector housing and method for producing same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4842540
SERIAL NO

07160040

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A connector housing assembly having a ring-like packing formed integrally with a resin housing member to provide an improved sealing function at a reduced manufacturing cost. The housing is formed by resin molding using male and female molds. In one embodiment of the invention, the first male mold is removed and replaced with another male mole shaped so as to form a hollow portion corresponding to the desired shape of the packing. Rubber material is poured into the hollow portion through lead-in paths in at least one of the female mold or the second male mold. In another embodiment, the two molds used to form the housing are both removed, and the first male mold is replaced with a second male mold defining the hollow portion used to form the packing.

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Patent Owner(s)

  • YAZAKI CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Endo, Takayoshi Shizuoka, JP 286 3437
Yamada, Satoshi Shizuoka, JP 284 3460

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