Process for bonding integrated circuit components
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United States of America Patent
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-
Jun 27, 1989
Grant Date -
N/A
app pub date -
Jun 1, 1988
filing date -
Jun 1, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Tape-automated-bonding (TAB) tape can be directly bonded (i.e., no 'gold bumps' are needed) to aluminum bonding pads of integrated circuit devices, without contacting any other part of the integrated circuit device, by use of a process employing the herein disclosed parameters of ultrasonic energy, pressure, time, heat, and relative dimensions of the TAB tape.
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