Method for encapsulating electronic devices
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United States of America Patent
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Jun 27, 1989
Grant Date -
N/A
app pub date -
Jun 29, 1987
filing date -
Jun 29, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of encapsulating an electronic device on a substrate comprises depositing a radiatively curable barrier wall to contain a subsequently deposited encapsulant. Alternatively, an encapsulant comprising a majority of radiatively curable material is used in the absence of a barrier wall.
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