Process for sawing crystal rods or blocks into thin wafers
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United States of America Patent
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-
Jul 4, 1989
Grant Date -
N/A
app pub date -
Nov 19, 1987
filing date -
Nov 28, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for the sawing of crystal rods or blocks into thin wafers by innal-hole saws is specified. In this process, the deviation of the saw blade from the intended cutting line, occurring in virtually every sawing operation, is countered by the force of a fluid being applied, at least periodically, to the side surfaces of the blade. This allows the force conditions in the saw cut and thus the deflection of the saw blade, to be influenced. This process results in an improved geometrical quality of the wafers obtained and in prolonged service life of the saw blades which have to be resharpened less often.
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