Laser Bonding apparatus and method
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United States of America Patent
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-
Jul 4, 1989
Grant Date -
N/A
app pub date -
Jan 28, 1988
filing date -
Jan 28, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.
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