Wafer transferring device

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United States of America Patent

PATENT NO 4846623
SERIAL NO

07106584

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A wafer transferring device for transferring a wafer to be treated from a wafer supply station of a wafer treating apparatus to a wafer holding member, where the wafer is treated, and from the holding member to a wafer discharge station. The device includes a transfer unit for separately supporting untreated and treated wafers at different heights relative to one another. A carrier unit moves horizontally and reciprocates between the supply and discharge stations and toward and away from the holding member integrally with the transfer unit and is adapted to move up and down the transfer unit.

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Patent Owner(s)

Patent OwnerAddress
DAINIPPON SCREEN MFG CO LTDKYOTO JAPAN KYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Himoto, Masahiro Takatsuki, JP 2 105
Nishida, Masami Muko, JP 62 1649
Otani, Masami Nagaokakyo, JP 5 47
Tsuchiya, Akio Muko, JP 1 26

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