Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines

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United States of America Patent

PATENT NO 4847349
SERIAL NO

07044028

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Abstract

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Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radial selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed polyaromatic radical wherein aromatic radicals ae mutually connected with a bond or a crosslinking function). Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, andy is isopropylidene radical and R is IV. The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride. Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

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Patent Owner(s)

Patent OwnerAddress
MITSUI CHEMICALS INC2-1 YAESU 2-CHOME CHUO-KU TOKYO 1040028 ?1040028

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawashima, Saburo Yokosuka, JP 32 325
Ohkoshi, Kouji Kanagawa, JP 10 139
Ohta, Masahiro Yokohama, JP 174 734
Oikawa, Hideaki Yokohama, JP 46 426
Sonobe, Yoshiho Yokohama, JP 24 296
Tamai, Shoji Yokohama, JP 70 646
Yamaguchi, Akihiro Kamakura, JP 281 1582

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