Moisture reduction in polyamide compositions
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United States of America Patent
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-
Jul 18, 1989
Issued Date -
N/A
app pub date -
Nov 10, 1988
filing date -
Jan 6, 1986
priority date (Note) -
Expired
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Abstract
Novel moisture resistant polyamide compositions are prepared comprising at least one polyamide and at least one di- or poly- hydric compound, oligomer or polymer free of sterically hindered hydroxy groups.
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