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United States of America Patent

PATENT NO 4850163
SERIAL NO

07145884

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Steps are formed around the peripheries of respective floor panels, so that wiring channels are formed between the side surfaces of adjacent floor panels when said floor panels are installed. As a result, the laying of power cables and communications cables on the floor surface, which is impossible in the case of conventional free-access floors, is made possible. Furthermore, these wiring channels are covered by wiring covers, thus eliminating any indentations or projections in the floor surface and providing a flat floor surface.

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Patent Owner(s)

Patent OwnerAddress
O M KIKI CO LTD635 NIGA KAWAKAMI-CHO KAWAKAMI-GUN OKAYAMA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobayashi, Tokuzo Okayama, JP 14 145
Watanabe, Iwao Okayama, JP 8 102

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