High density flexible circuit connector
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United States of America Patent
Stats
-
Jul 25, 1989
Grant Date -
N/A
app pub date -
May 21, 1987
filing date -
May 21, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A clamping system for use in connecting high density flexible circuit to a rigid printed circuit board. The clamping system utilizes metal-on-elastomer (MOE) strips contained in a MOE holder and held in place by clamping components to provide electrical connections between the high density flexible circuit and the rigid printed circuit board. The clamping system utilizes a flexible mouth surrounding the high density flexible circuit to alleviate stress on the high density flexible circuit, a special plating on the conductors of the high density flexible circuit to prevent oxidation, and a stiffener clamp to provide stability for the MOE strips.
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