Flexible circuit laminate for surface mount devices
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United States of America Patent
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Jul 25, 1989
Grant Date -
N/A
app pub date -
Jun 8, 1988
filing date -
Jun 8, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The disclosed invention provides a flexible circuit board for use in surface mount technology. A polyaramid fiber reinforced resin provides a substrate for a copper cladding in which a circuit is formed. Overlaying the circuitry are a plurality of spaced insulating pads also reinforced with polyaramid fiber for dimensional stability. The spaces insulated pads define fold-lines along which the circuit may be folded, thereby providing a degree of flexibility required for flexible circuit applications.
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